TI second 300mm fab in Utah

Once completed, the Lehi fabs will operate as a single unit.

“This new fab is part of our long-term, 300mm manufacturing roadmap,” TI COO Haviv Ilan. “With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the Chips and Science Act, there is no better time to invest in our internal manufacturing capacity.”

Construction of is scheduled to begin in the second half of 2023, with production “as early as 2026”, said TI.

The company also has 300mm fabs in Dallas (DMOS6) and Richardson, Texas (RFAB1 and RFAB2), and it building four in Sherman, Texas.

The Lehi fab will be designed to meet the US LEED (leadership in energy and environmental design) Gold structural efficiency and sustainability target. Plans include recycling water better than the existing Lehi fab, as well as reducing waste and energy consumption per chip.